KTH Royal Institute of Technology

Contact persons:

Mikael Östling

KTH Royal Institute of Technology
SE-100 44,

Stockholm,

 Sweden

Equipment / Facilities

Processing platform

1300 m2 clean room handling up to 200 mm wafer size
FD-SOI CMOS technology platform on 100 mm wafers
SiC bipolar/MOSFET technology platform on 100 mm wafers
MEMS processing platform
 
http://www.myfab.se/
 
Major Equipment:
AMAT P5000: RIE SiO2, SiN
AMAT P5000: RIE Si, SiGe, SiC
AMAT P5000: RIE AL, TiN, TiW
AMAT P5000: PECVD SIO2, SiN
AMAT Endura: PVD Ni, TiW, Al
AMAT Centura: Deep Silicon Etch
MATTSON RTP: Annealing, Oxidation
ASM Epsilon2000: CVD Si, SiGe, Ge, GeSn
Nikon NSR TFHi12: I-line (365 nm) stepper lithography
BENEQ TFS200: ALD SiO2, TiN, AL2O3, HfO2, Tm2O3
IPEC/Axus Avanti 472: CMP SiO2, SiC
Thermco: Furnaces Anneals N2, O2, N20
Aixtron 200/4: MOVPE GaAs,InP, InAs, GaSb

Modelling platform

Process Design Kit (Cadence environment) for KTH’s FD SOI CMOS Technology.
Synopsys Sentaurus TCAD Simulation

Characterization platform

Semi-automatic probe station for on wafer electrical characterization (Keithley 4200)
High Temperature (up to 500 °C) on wafer electrical characterization
Physical Characterization: HRXRD, HRSEM, TEM, Spectroscopic Ellipsometry, AFM

Expertise

Beyond CMOS

More Moore / Logic devices & circuits

  • FD SOI CMOS technology platform
  • SiGe and Ge MOSFET devices

More Moore / Memories

More than Moore / Sensors

  • Implantable bio-sensors
  • Si nanowire top-down fabrication

More than Moore / Energy Harvesting

  • Low power circuit design

More than Moore / RF devices & circuits

  • Low power circuit design

More than Moore / Photonics devices

  • III-V epitaxy (MOVPE) of GaAs and InP-based materials and device structures
  • Edge-and surface-emitting lasers and detectors
  • Heterogeneous integration

More than Moore / Power devices

  • SiC BJT and MOSFETs

Flexible electronics / Organic devices

  • Graphene based super capacitors

Flexible electronics / Others

Smart systems

Systems design

  • Feasibility study, Architecture partition, Design hardware/software, Test and Validation
Research interests

Beyond CMOS

More Moore / Logic devices & circuits

  • Monolithic 3D integration
  • High mobility channels, gate stacks

More Moore / Memories

More than Moore / Sensors

  • Biomedical
  • Integration of sensors with CMOS

More than Moore / Energy Harvesting

  • Integration with CMOS

More than Moore / RF devices & circuits

More than Moore / Photonics devices

  • Integrated light sources on SOI and bulk silicon substrates
  • High-power photonic crystal-confined lasers
  • Single-photon emitters
  • Solar cell structures

More than Moore / Power devices

  • High temperature applications
  • High power applications

Flexible electronics / Organic devices

Flexible electronics / Others

Smart systems

Systems design

  • Biomedical