Université Catholique de Louvain (UCL)

Contact persons:

Valeriya Kiltchytska

Tel. +32 10 472564

Mail: valeriya.kilchytska@uclouvain.be

Université catholique de Louvain (UCL) is the largest university in the French community of Belgium with more than 30,000 students. ICTEAM institute gathers 300 researchers in electrical engineering, computer science and applied mathematics with 40 faculty members. ICTEAM delivers 50 PhD and more than 150 journal papers a year. It runs two major experimental infrastructures: Winfab, Wallonia Nano Fabrication Infrastructure, and Welcome, Wallonia Electronics and Communications Measurements. Electrical Engineering department (ELEN) is a multi-disciplinary team of device physicists, technologists, experimentalists, analog, RF and digital circuit designers.

Equipment / Facilities

Processing platform

List of processing equipments is available at https://sites.uclouvain.be/winfab/NEW_website/login.html

Modelling platform

Characterization platform

Equipment list for “characterization” is available at https://sites.uclouvain.be/welcome/

Expertise

Beyond CMOS

  • Graphene
  • Phase change materials (VO2)

More Moore / Logic devices & circuits

More Moore / Memories

  • Design of SRAMs in advanced CMOS technologies

More than Moore / Sensors

  • Simulation, fabrication, characterization of biological, chemical and physical sensors, notably in SOI CMOS compatible technology or for harsh environments (temperature, radiations)

More than Moore / Energy Harvesting

  • Solar cells (black Si, CIGS, CZTS) : fabrication, characterization, simulation
  • Design of ULP CMOS harvesters for light, thermal and RF energy

More than Moore / RF devices & circuits

  • Modelling and characterization of RF passive and active devices
  • Design of CMOS RF circuits and sub-systems

More than Moore / Photonics devices

  • Thin SOI photodiodes (UV to visible) with graphene gate, optical reflectors…
  • SOI waveguides with graphene modulators

More than Moore / Power devices

  • Simulation and characterization of power devices in harsh environments (temperature, radiations)

Flexible electronics / Organic devices

Flexible electronics / Others

  • Ultra thinning of SOI CMOS dies to a few µm by XeF2
  • Transfer of high-quality monolayer graphene on flexible substrate

Smart systems

  • Design of CMOS systems-on-chip (analog, RF, digital, memories) especially in attached UTBB FD SOI with adaptive back bias

Systems design

  • PCB level integration of ultra low power systems : sensors, energy harvesting, analog and digital signal processing, RF chips, passive RFID tags, antennas
Research interests

Beyond CMOS

  • Ultra-high frequency (THz) rectifier
  • Optical modulator
  • RF and millimeter-waves switches

More Moore / Logic devices & circuits

More Moore / Memories

  • Novel ULP patented cell for embedded SRAMs

More than Moore / Sensors

  • Bacteria, DNA
  • gases, breath
  • Temperature, water vapour, pressure, flow, mechanical stress, magnetic, light, radiation, …

More than Moore / Energy Harvesting

  • High-efficiency indoor ambient energy harvesting
  • Ultra-high frequency (THz) graphene rectifier
  • Biomedical applications

More than Moore / RF devices & circuits

  • SOI MOSFETs, diodes, engineered substrates, antenna
  • UWB, 5G

More than Moore / Photonics devices

  • Multiple wavelength detection with high sensitivity
  • Optical modulator

More than Moore / Power devices

  • Si / SiC LDMOS, RF LDMOS, RF SOI switches, RF SOI Power Amplifier

Flexible electronics / Organic devices

Flexible electronics / Others

  • Ultra-thin Si sensors (temperature, RH, strain, light) and circuits for biomedical patches, structural health monitoring, radiation resistance,…
  • Graphene as strain gauge on microsensors and in composite materials

Smart systems

  • RF communications (UWB, 5G), Ultra low power / voltage circuits, CMOS imagers…

Systems design

  • Multiple applications: biomedical, aerospace, automotive…