VTT Technical Research Centre of Finland Ltd
Minatec – CROMA
3 Parvis Louis Néel, CS 50257
38016 Grenoble Cedex 1, France
+33 456 52 95 09
contact@sinano.eu
Main expertises
Novel computing architectures (Neuromorphic, Quantum...)
- Neuromorphic, analogue in-memory and quantum computing
Phonon engineering
- Optoelectromechanical and nanomechanical systems, thermal management, topological phononics
Small slope switches-TFET/Fe Transistors/Dirac-Source FET/NEMS/etc.
- Ferroelectrics, thin-film transistors
Alternative materials-2D layers
- Graphene
Very low temperature electronics
- Cryogenic CMOS
Amorphous Oxide Semiconductor FETs
- ALD, sputtering and solution-based thin-film processes
Research interests
Novel computing architectures (Neuromorphic, Quantum...)
- Low-power edge computing IC, post-CMOS integration, cryogenic CMOS, new materials, ferroelectric NVMs, integrated photonics, superconducting quantum computer HW
Phonon engineering
- Low power ITC systems, quantum technologies
Small slope switches-TFET/Fe Transistors/Dirac-Source FET/NEMS/etc.
- Ferroelectric transistors, post-CMOS integration
Alternative materials-2D layers
- Graphene-based sensors, post-CMOS integration
Very low temperature electronics
- Quantum computer control and readout
Amorphous Oxide Semiconductor FETs
- Metal-oxide FETs for sensors
Main expertises
Logic Nanodevices & circuits/FDSOI, Nanosheet, Stacked channels, etc.
- ASIC and MMIC design and characterization
Very low power devices
- Ultra low power sensor interfaces
Research interests
Logic Nanodevices & circuits/FDSOI, Nanosheet, Stacked channels, etc.
- Sensor readout IC, radio-frequency front ends for wireless communication and sensing
Very low power devices
- MEMS and bio sensors
Main expertises
Micro-nano-bio Sensors & Systems
- Graphene, MEMS, sensor readout IC, post-CMOS integration
RF devices & circuits
- RF-MEMS, NOEMS, MMIC up to 700 GHz, BAW filters, IPDs
Photonics devices
- Silicon photonics (thick-SOI and SiN platforms), F-P interferometers, hyperspectral imaging
Power devices
- Materials and device development
Flexible electronics
- Printed electronics, roll-to-roll and sheet-to-sheet processes
Others
- Quantum
Research interests
Micro-nano-bio Sensors & Systems
- Graphene bio sensors, artificial nose, room-temperature IR bolometer arrays
RF devices & circuits
- 5G, 6G and SATCOM applications
Photonics devices
- ITC, environmental and medical applications, photonic chip interconnect, IR bolometers, imaging solutions
Power devices
- (U)WBG materials and devices
Flexible electronics
- High-accuracy printing for flexible transistors and circuits, wearable electronics
Others
- Superconducting quantum sensing and computing HW
Main expertises
Heterogeneous Integration, & Advanced Packaging
- 2.5D/3D integration
Research interests
Heterogeneous Integration, & Advanced Packaging
- 2.5D/3D integration