Contact persons:

Mireille Mouis, Francis Balestra

Anne Kaminski (for IMEP-LAHC)

3 Parvis Louis Neel, Minatec, Grenoble, FRANCE

Grenoble INP is a federation of 11 engineering schools and 24 research laboratories. Its research fields of interest are in Micro and Nano technologies, sciences of information and communication, materials, environment, energy and manufacturing systems. Grenoble INP has been developing partnership with industry for more than a century. It has created many spin-offs and has presently leading role in industrial clusters.

Research activities of IMEP-LaHC cover large areas (materials, technologies, components, circuits and systems) which allow carrying out multidisciplinary research in common with our partners in nano-physics and -technologies, material chemistry, device engineering, circuit design or system manufacturing in electronics and optoelectronics.
Situated at convergence of many sciences and technologies, IMEP-LaHC can play an important federating role to develop ambitious projects and to challenge the future of electronics.

Equipment / Facilities

Processing platform

IMEP-LaHC

  • Clean room (65 m2, class 100): photolithography, RIE, sputtering, evaporation…
  • Clean room for glass photonics
  • Integrated optics technology based on ions exchange processes in diffusion furnaces

Modelling platform

IMEP-LaHC

  • Fully coupled mechanical/piezoelectrical/semi-conducting FEM simulation of nanostructures, electromechanical response
  • 3D electromagnetic modelling coupled with TCAD tools for PV cells simulation
  • 3D electromagnetic modelling for integrated optics
  • 3D electromagnetic modelling for RF devices simulations
  • 3D multiphysics modelling for coupled biological and electromagnetic structures
  • 3D quantum simulation
  • Circuit design

Characterization platform

IMEP-LaHC

  • Electrical characterization : DC, AC, pulsed, spectroscopic, noise (low frequency, Random telegraph…), with magnetic field, with variable temperature.
  • Atomic Force Microscopy
  • Integrated photonic characterization bench, digital transmission (Radio over Fiber, FFTH…), test benches. SHG (Second Harmonic Generation) characterization.
  • RF characterization: Anechoïd chamber fully equiped with automated antenna test bench, RF and mm-wave VNA and SA with manual probe station
Expertise

Beyond CMOS

IMEP-LAHC

  • Devices characterization and design:
    • Transistors: III-V on Si, 2D materials,
    • Negative Capacitance FETs (Steep Slope)
  • Electrical characterization and related modelling:
    • Parameter extraction for device operation analysis (including electronic transport, electrostatic coupling and interface quality)
    • Static and dynamic variability analysis
  • 3D Quantum simulation 
  • Circuit design

More Moore / Logic devices & circuits

More Moore / Memories

IMEP-LAHC

  • Analysis of commutation mechanisms, retention…

More than Moore / Sensors

IMEP-LAHC

  • Processing
  • Bio functionalization (with DNA or aptamer) for detection specificity
  • Analysis with account for coupling effects, traps, variability, low frequency noise and hysteresis effects
  • Development of associated compact models

More than Moore / Energy Harvesting

IMEP-LAHC

  • Photovoltaics : 3D electromagnetic modelling coupled with TCAD tools for PV cells simulation, characterization (quantum efficiency, reflectivity, SHG, transport mechanisms, passivation….)
  • Fully coupled mechanical/piezoelectrical/semi-conducting FEM simulation of nanostructures, electromechanical response
  • Characterization under mechanical stress (pressure, flexion)

More than Moore / RF devices & circuits

IMEP-LAHC

  • Design and test of RF functions
    • RF front-end
    • IoT Protocols
    • Antennas

More than Moore / Photonics devices

IMEP-LAHC

  • Integrated photonics :
    • Silicon Photonics
    • Glass photonic (ion exchange, 3D integration)
    • Hybrid photonics (glass interposer, polymer-glass devices, wafer-bonding and 3D integration)
  • Photonic Design and test of optical and electro-optical functions
    • 3 D electromagnetic modelling for integrated optics
    • Characterization: integrated photonic characterization bench, digital transmission (Radio over Fiber, FFTH…) test benches

More than Moore / Power devices

IMEP-LAHC

  • Functional and electrical characterization

Characterization of power devices (on wafer, DC, AC, pulsed 20V to 3kV, temperature -200°C to +300°C)

Flexible electronics / Organic devices

IMEP-LAHC

  • Analysis of OFET

Flexible electronics / Others

IMEP-LAHC

  • Design and DC/RF characterization of cellulosic material based RF devices

Smart systems

IMEP-LAHC

  • Sensors,
  • Energy harvesting,
  • Computation and communication

Systems design

Research interests

Beyond CMOS

IMEP-LAHC

  • Steep slope devices for ultra low power (ULP)
  • 2D materials based devices
  • Dynamic variability in nanoscale devices
  • Neural inspired networks (for recognition, classification, image processing and personalized medecine)

More Moore / Logic devices & circuits

More Moore / Memories

IMEP-LAHC

  • RRAMs, MRAMs, Memristors and related neuromorphic functions
  • Gate stacks for FeRAM

More than Moore / Sensors

IMEP-LAHC

  • Field-effect and Photonics based biosensors for 3D integration on CMOS or on glass (applications in health and/or environment monitoring)

More than Moore / Energy Harvesting

IMEP-LAHC

  • Energy harvesting (macro/micro/nano) of mechanical energy, light, RF energy

More than Moore / RF devices & circuits

IMEP-LAHC

  • RFID
  • Antennas
  • IoT

More than Moore / Photonics devices

IMEP-LAHC

  • Optoelectronics, photonics on Silicon and III-V hybridation
  • Radio on fiber

More than Moore / Power devices

IMEP-LAHC

  • Power electronics (SiC, GaN)

Flexible electronics / Organic devices

Flexible electronics / Others

IMEP-LAHC

  • Integration on biosourced flexible substrates

Smart systems

Systems design