Contact persons:

Mireille Mouis, Francis Balestra

Anne Kaminski (for IMEP-LAHC)

3 Parvis Louis Neel, Minatec, Grenoble, FRANCE

Grenoble INP is a federation of 11 engineering schools and 24 research laboratories. Its research fields of interest are in Micro and Nano technologies, sciences of information and communication, materials, environment, energy and manufacturing systems. Grenoble INP has been developing partnership with industry for more than a century. It has created many spin-offs and has presently leading role in industrial clusters.

Research activities of IMEP-LaHC cover large areas (materials, technologies, components, circuits and systems) which allow carrying out multidisciplinary research in common with our partners in nano-physics and -technologies, material chemistry, device engineering, circuit design or system manufacturing in electronics and optoelectronics.
Situated at convergence of many sciences and technologies, IMEP-LaHC can play an important federating role to develop ambitious projects and to challenge the future of electronics.

Equipment / Facilities

Processing platform

IMEP-LaHC

  • Clean room (65 m2, class 100): photolithography, RIE, sputtering, evaporation…
  • Clean room for glass photonics
  • Integrated optics technology based on ions exchange processes in diffusion furnaces

Modelling platform

IMEP-LaHC

  • Fully coupled mechanical/piezoelectrical/semi-conducting FEM simulation of nanostructures, electromechanical response
  • 3D electromagnetic modelling coupled with TCAD tools for PV cells simulation
  • 3D electromagnetic modelling for integrated optics
  • 3D electromagnetic modelling for RF devices simulations
  • 3D multiphysics modelling for coupled biological and electromagnetic structures
  • 3D quantum simulation
  • Circuit design

Characterization platform

IMEP-LaHC

  • Electrical characterization : DC, AC, pulsed, spectroscopic, noise (low frequency, Random telegraph…), with magnetic field, with variable temperature.
  • Atomic Force Microscopy: PFM, CAFM, KPFM, SMIM
  • Integrated photonic characterization bench, digital transmission (Radio over Fiber, FFTH…), test benches. SHG (Second Harmonic Generation) characterization.
  • RF characterization: Anechoïd chamber fully equiped with automated antenna test bench, RF and mm-wave VNA and SA with manual probe station
  • THz characterization : Time domain spectrometer, High resolution spectrometer, THz imaging
Expertise
Main Expertises
Beyond CMOS Neuromorphic Computing
  • IMEP-LaHC: Device modelling and simulation of Oxide based ReRAm
  • LMGP: Multilevel analogue type resistive switching devices
Phonon engineering x
Small slope switches-NW/TFET/NEMS
  • IMEP-LaHC: Simulation of steep slope device with NEGF
Alternative materials-2D layers
  • IMEP-LaHC: Quantum simulation of 2D material device (Graphene, MoS2 etc
  • IMEP-LaHC: Complex dielectric permittivity measurement specific samples and in-situ
  • LMGP: Lamellar dichalcogenides by Atomic Layer Deposition
Novel devices for ultra-low power x
1D x
Quantum Technologies & Very low temperature electronics
  • IMEP-LaHC: Electrical characterization at very low temperature (<10K) of transistors for CMOS circuit addressing Qbits. Compact modelling for circuit simulation at very low T.
More Moore Logic Nanodevices& circuits
  • IMEP-LaHC: General and historic expertise in CMOS device electrical characterization, modelling and simulation. Circuit simulation in VerilogA using compacts models (some in-house)
Memories
  • IMEP-LaHC: Device modelling and simulation of Oxide based ReRAm
  • IMEP-LaHC: New architectures of memories (Z²FET) for DRAM
  • LMGP: Valence change nanoionic resistive switching devices
Very low power devices x
High temperature electronics
  • IMEP-LaHC: Expertise in SiC (part of manufacturing, electrical characterization and modelling). Collaboration on GaN
More than Moore micro-nano-bio Sensors & Systems
  • IMEP-LaHC: Development of novel sensor architectures and new approaches of more efficient dynamic signal for detections. Electrical characterization of sensors
  • IMEP-LaHC:Design of microelectrodes, DEP
  • LMGP: Deposition of Oxide thin films and nanostructures for gas sensors
  • LMGP: Integration of seminconducting nanonets (nanowire networks)
Energy Harvesting
  • IMEP-LaHC: Full expertise in piezo mems and nems characterization and modelling, assisted by state of the art AFM for electrical characterization
  • IMEP-LaHC: Photovoltaics: 3D electromagnetic modelling coupled with TCAD tools for PV cells simulation, characterization (quantum efficiency, reflectivity, SHG, transport mechanisms, passivation….)
  • IMEP-LaHC: Fully coupled mechanical/piezoelectrical/semi-conducting FEM simulation of nanostructures, electromechanical response
  • IMEP-LaHC: Characterization under mechanical stress (pressure, flexion)
  • IMEP-LaHC: AFM characterization: PFM, KPFM, CAFM, SMIM
  • LMGP: All-oxide solar cells as PV harvesters for outdor and indoor applications
  • LMGP: Piezoelectric nanogenerators made of ZnO nanowires
RF devices & circuits
  • IMEP-LaHC: TeraHertz characterization of material and devices
    • THz characterization of material in the 0.2- 3 THz band
    • Characterization of THz detectors and emitters
  • IMEP-LaHC: Passive circuits
  • IMEP-LaHC: RF characterization up to 110 GHz (+probe station)
  • IMEP-LaHC: RF Design
Photonics devices
  • IMEP-LaHC: Modelling of photodetectors (Ge, Si) or PV application, device electrical characterization, in particular in low temperature, focused on the degradation mechanisms of these device for reliability assessment
  • IMEP-LaHC: Integrated photonics :
    • Glass photonic (ion exchange, 3D integration)
    • Hybrid photonics (glass interposer, polymer-glass devices, wafer-bonding and 3D integration)
    • Silicon Photonics
    • Photonic based sensors
  • IMEP-LaHC: Photonic Design and test of optical and electro-optical functions
    • 3 D electromagnetic modelling for integrated optics
    • Characterization: integrated photonic characterization bench, digital transmission (Radio over Fiber, FFTH…) test benches
  • LMGP: Light emitting diodes made of ZnO nanowires
  • LMGP: Self-powered UV photodetectors made of ZnO nanowires
Power devices x
Flexible electronics
  • LMGP: Deposition of thin oxide films by Spatial ALD, ALD and CVD. P-type oxides
  • LMGP: Composite materials (nanowires, nanoparticles, oxides)
  • LMGP: Flexible and stable fabrication of transparent electrodes based on metallic nanowire networks
  • LMGP: Nanonet-based devices
  • IMEP-LaHC: Passive circuits
  • IMEP-LaHC:  Antenna systems
  • IMEP-LaHC: RF design and characterization
Smart systems& Systems design Smart systems x
Systems design x
Research interests
Research interests
Beyond CMOS Neuromorphic Computing
  • IMEP-LaHC: Simulating and accessing the right figure of merits for hardware accelerated neuromorphic computing
  • LMGP: Nanoionic-based devices for neuromorphic computing
Phonon engineering x
Small slope switches-NW/TFET/NEMS x
Alternative materials-2D layers
  • LMGP: Growth and properties of 2D materials
  • IMEP-LaHC: Eco-design of RF devices
Novel devices for ultra-low power x
1D x
Quantum Technologies & Very low temperature electronics
  • IMEP-LaHC: Estimation of noise at very low temperature, future RF+ very low T measurement.
More Moore Logic Nanodevices& circuits
  • IMEP-LaHC: Variability and noise in CMOS, up to compact modelling and small circuit simulation.
Memories
  • IMEP-LaHC: Developing more accurate simulation of OxRAM device, explaining in particular the variability and the performance of OxRAM
  • LMGP: New Resistive switching devices based on nanostructures
  • LMGP: Nanoionic materials for microelectronics
Very low power devices x
High temperature electronics
  • IMEP-LaHC: Collaboration on GaN with LETI
More than Moore micro-nano-bio Sensors & Systems
  • IMEP-LaHC: SiC for sensors, new material for sensors, new detection schemes (dynamic ones)
  • IMEP-LaHC: Network of nanowires for detection (Si & ZnO)
  • IMEP-LaHC: Impedancemetric bio-sensors
  • LMGP: MEM-based and resistive sensors, bio sensors based on oxide thin films and nanostructures
  • LMGP: FET- and resistor-based sensor with or without surface functionalization
  • LMGP: Flexible and/or transparent devices
Energy Harvesting
  • IMEP-LaHC: ZnO nanowires for energy harvesting
  • LMGP: Flexible, low-cost devices adapted for BIPV and miniaturized devices based on oxide thin films
  • LMGP: Chemical synthesis and controlled properties of ZnO nanowires including morphology, doping, polarity, and surfaces.
  • LMGP: Implementation of n and p-tupe oxides in thermoelectric devices
RF devices & circuits
  • IMEP-LaHC: Time domain Characterization of THz integrated circuits
  • IMEP-LaHC: THz identification (such as RFID but in the THz freq. range)
  • IMEP-LaHC: THz imaging
  • IMEP-LaHC: IC packaging,
  • IMEP-LaHC: Complex modelling and characterization of 3D RF IC structures, interconnections
Photonics devices
  • IMEP-LaHC: Understanding the physical origin of the degradation mechanisms evidenced on photodetectors, proposing new accelerated test to evaluate the lifetime of device, suggesting tracks for technological improvement of photodetectors.
  • IMEP-LaHC: Optoelectronics, photonics on Silicon and III-V hybridation
  • IMEP-LaHC: Radio over fiber
  • IMEP-LaHC: Integrated glass lasers for THz generation
  • LMGP: Advanced photonic substrates and components for all-oxide solar cells
  • LMGP: Investigation of heterojunctions and interfaces between ZnO nanowires and GaN for LEDs, as well as between ZnO nanowires and semiconducting shells for UV photodetectors.
Power devices x
Flexible electronics
  • IMEP-LaHC: POC of RF devices fabricated with biosourced substrates and additive technologies
  • LMGP: Oxide electronics, new transparent conductive materials
  • LMGP: Understanding and optimization of stable and flexible transparent electrodes based on metallic nanowire networks
  • LMGP: Basic devices fabrication with good performance and reproducibility on flexible substrate
Smart systems& Systems design Smart systems x
Systems design x